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Samsung, SK hynix showcase latest HBM4 chips at 2025 SEDEX
Samsung Electronics Co. and SK hynix Inc. on Wednesday showcased their latest high bandwidth memory (HBM) chips at a ...
Samsung Electronics will hold its largest in-house technology event, “Samsung Tech Expo,” to share the direction of ...
Samsung foundry boosts 4nm logic die yield to over 90% to support HBM4 production Samsung boosts 4nm logic-die yield above 90 ...
Micron announces industry leading HBM4 with 2.8TB/s bandwidth and 11Gbps pin speeds, claiming performance advantage over Samsung and SK Hynix.
Nojung Kwak, President and Chief Executive Officer (CEO) of SK Hynix, expressed confidence in the company's competitive edge ...
JEDEC is still finalizing the HBM4 memory specifications, with Rambus teasing its next-gen HBM4 memory controller that will be prepared for next-gen AI and data center markets, continuing to expand ...
SK hynix has pulled ahead of its memory rivals by bagging NVIDIA’s first HBM4 orders, giving the South Korean chipmaker a premium position for the launch of Nvidia's Rubin GPUs. According to DealSite, ...
Hanmi Semiconductor announced on October 22 that it will participate in 'Semiconductor Exhibition (SEDEX) 2025,' held at COEX ...
Samsung Electronics is preparing to enter the final quality testing phase for Nvidia's sixth-generation high-bandwidth memory ...
Samsung yields for 1c DRAM HBM4 rumored at around 50% with yield stabilization in process, ready for NVIDIA Rubin AI GPUs to compete with SK hynix, Micron.
Micron (MU) stands out in AI data center memory growth with HBM innovation and strong demand. Read here for deeper insights on this memory stock.
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