JNTC, a South Korean advanced-materials company, said on June 19 that it has developed a through-glass-via (TGV) substrate 2.0 millimeters thick — which it bills as an industry first — giving it TGV ...
SEOUL, South Korea, July 14, 2025 /PRNewswire/ -- JNTC Co., Ltd. (KOSDAQ: 204270), a leading advanced materials company, hosted a product launch on June 30 at the Korea Exchange Conference Hall, ...
Morning Overview on MSN
TSMC’s new glass-based packaging could make the next wave of AI chips cheaper to build
Companies building the largest AI accelerators face a growing cost problem that has nothing to do with transistors. The expense of packaging those chips, connecting multiple silicon dies on a single ...
JNTC has entered the full-fledged stage of expanding the global supply chain for TGV glass substrates. JNTC (Co-CEOs Namhyuk Cho and Yoonjung Jang), which is growing as a global advanced materials ...
The market for fan-out panel-level packaging (FO-PLP) and glass substrates is set to grow more than tenfold in five years, as Intel, TSMC, and others race to adopt the large-area packaging that ...
HSINCHU, June 17, 2025 /PRNewswire/ -- Professional semiconductor equipment provider Spirox Corporation (TWSE: 3055) has introduced the industry-first SpiroxLTS (Spirox Laser Tomography Scanning) ...
China's glass substrate through glass via (TGV) industry has made significant progress, with companies pushing innovations from materials to mass production. Despite challenges in yield and process ...
Hana Technology, a South Korean equipment maker formerly focused on battery solutions, has developed core Through Glass Via (TGV) technology for semiconductor glass substrates, signaling its move into ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results