Apple to reportedly use TSMC's advanced WMCM and SoIC packaging for next-gen A20 and server chips, monthly wafer production ...

Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new ...

Advanced packaging continues to gain momentum, with the industry closely watching as TSMC not only secures large orders from ...

Apple is planning to overhaul its chip design for the 2026 iPhones, in a move that could mark the first time it uses advanced multi-chip packaging in a mobile device. It sounds complicated, but ...

According to the report, key supply chain segments, such as printed circuit boards, printing and packaging, molded and ...

Apple launched the M2 Mac mini in January 2023, though the affected units were made between June 16 and November 23 of 2024, ...

The Carlsberg Britvic owned brand has added NaviLens technology to its packaging. This is a code that, when scanned with a ...

Good post by Parker Ortolani, analyzing the pros and cons of a potential Perplexity acquisition by Apple: According to Mark Gurman, Apple executives are in the early stages of mulling an acquisition ...

My professional career has spanned six major tech changes: minicomputer, PC, internet, social, mobile, and cloud. Each of ...