BE Semiconductor leads in die-attach tech for AI chips, with strong 2026–2028 growth expected from advanced packaging demand.

Flexible packaging maker ProAmpac is adding more paper to its diet, announcing it has acquired the bag converting operations ...

The exhibition will be held from December 16 to 18 at the Baoan New Pavilion, with a scale reaching 250,000 square meters.

Better Safety: Solid-state batteries are less prone to combustion or explosion, making them safer to use.

The secret family tree of gearboxes: from supercars to sedans, meet the transmissions quietly linking rivals under the skin, ...

The global injection molding market is set to reach $426.7 billion by 2032, growing at a CAGR of 4.6% from 2025 to 2032. Extensive research highlights key trends across major regions, driven by demand ...

Fabrinet is a leading provider of advanced optical packaging and precision optical, electro-mechanical, and electronic manufacturing services to original equipment manufacturers of complex products, ...

Gold prices are soaring to historic levels, drawing newcomers and regulars alike to New York’s diamond district.

The balance comes from investing in emerging trends without abandoning the proven capabilities that already differentiate ...

With a host of other players also vying for the B2B investor attention, Moglix will have its work cut out when the IPO dates ...

Global Meat Packaging market, USD 51.95B in 2024 to USD 85.49B by 2032 at 6.49% CAGR; Asia Pacific 40.76%, U.S. ~USD 14.02B ...

American defense contractor AeroVironment announced the launch of the VAPOR Compact Long Endurance (CLE) unmanned aircraft ...